Thank you for your answer to my previous post. It's made PLACING objects much easier for small pin pitch packages in a board. The device manufacturer specifies a 3mil solder mask around a SMD pad with a 1:1 pin/pad ratio for the CREAM. This is called a NonSolderMaskDefined(NSMD) footprint. EAGLE's default CREAM mask is already 1:1, but the solder mask is 4mil. Can I change the default solder mask to 3mil in the Library Package Edit level? I am aware that it can be done in the DRC at the BOARD level, but it would be nice to have this included in the Library package as default. I think the extra 1mil helps prevent solder bridges.